APPLIED MATERIALS INC
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Applied Materials, Inc. engages in the development, manufacture, marketing, and service of integrated circuit fabrication equipment for the semiconductor industry worldwide. It offers systems that perform the chip fabrication process, including atomic layer deposition chemical vapor deposition, physical vapor deposition, electrochemical plating, etch, ion implantation, rapid thermal processing, chemical mechanical polishing, wafer wet cleaning, wafer metrology and inspection, and flat panel display manufacturing, as well as systems that etch, measure, and inspect circuit patterns on masks used in the photolithography process. The company's integrated chips are built on a silicon wafer base and include various circuit components, such as transistors and other devices that are connected by various layers of wiring. It supplies systems for manufacturing copper-based chips, and for depositing, etching, and planarizing the copper interconnect layers. The company's products are marketed and sold worldwide through a direct sales force. It serves semiconductor wafer manufacturers and integrated circuit manufacturers in Taiwan, North America, Japan, Korea, Europe, and Asia Pacific. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.