CABOT MICROELECTRONICS CORPORATION
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Cabot Microelectronics Corporation engages in the development, manufacture, and sale of slurries for chemical mechanical planarization process (CMP). CMP is a polishing process used by IC device manufacturers to planarize or flatten many of the multiple layers of material that are built upon silicon wafers in the production of advanced integrated circuits. The company offers CMP slurries and pads. CMP slurries are liquid solutions generally composed of high-purity deionized water, proprietary chemical additives, and engineered abrasives that chemically and mechanically interact with the surface material of the integrated circuit device at an atomic level. CMP pads are engineered polymeric materials designed to distribute and transport the slurry to the surface of the wafer and distribute it evenly across the wafer. Cabot Microelectronics Corp.'s CMP products are used in various applications, such as polishing insulating dielectric layers; tungsten that is used to connect the multiple wiring layers of integrated circuit devices through these insulating layers; and copper wiring, including the associated barrier film. The company also offers CMP slurries for polishing various components in hard disk drives, specifically rigid disk substrates and magnetic heads. Cabot Microelectronics Corp. markets its products primarily in Asia Pacific region. The company was co-founded by William P. Noglows in 1999. Cabot Microelectronics Corp. is headquartered in Aurora, Illinois.